发明名称 |
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR LIGHT-EMITTING DEVICE |
摘要 |
A semiconductor package and a semiconductor light-emitting device including the semiconductor package. The semiconductor package includes: a frame for mounting a semiconductor light-emitting element; and a lead integral with the frame. The frame and the lead are made of a resin. A metal film is located in a predetermined area on the frame.
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申请公布号 |
US2009321777(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090348027 |
申请日期 |
2009.01.02 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
MITSUYAMA HIROSHI;YAJIMA KOTARO;TERAI NAOKAZU |
分类号 |
H01L31/0203;H01L23/495 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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