发明名称 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LOCKING TERMINAL
摘要 An integrated circuit package system includes: forming a first locking terminal having a first terminal recess with a top portion of the first terminal recess narrower than a bottom portion of the first terminal recess; connecting an integrated circuit and the first locking terminal; and forming a package encapsulation over the integrated circuit and in the first locking terminal.
申请公布号 US2009321913(A1) 申请公布日期 2009.12.31
申请号 US20080146192 申请日期 2008.06.25
申请人 SHIM IL KWON;CHOW SENG GUAN 发明人 SHIM IL KWON;CHOW SENG GUAN
分类号 H01L23/48 主分类号 H01L23/48
代理机构 代理人
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