发明名称 |
APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY |
摘要 |
Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
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申请公布号 |
US2009325347(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090554523 |
申请日期 |
2009.09.04 |
申请人 |
HARRIES RICHARD J;RANGARAJ SUDARASHAN V;SANKMAN BOB |
发明人 |
HARRIES RICHARD J.;RANGARAJ SUDARASHAN V.;SANKMAN BOB |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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