Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestelltes Zwischenprodukt,申请号DE20071030284-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestelltes Zwischenprodukt
摘要
申请公布号	DE102007030284(B4)	申请公布日期	2009.12.31
申请号	DE20071030284	申请日期	2007.06.29
申请人	SCHOTT AG	发明人	LEIB, JUERGEN
分类号	H01L21/58;B81C3/00;H01L21/56	主分类号	H01L21/58
代理机构		代理人
主权项
地址

您可能感兴趣的专利

ROTOR FOR ROTARY ELECTRIC MACHINE

APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE

MULTISTORIED PARKING GARAGE AND PARKING GARAGE GREENING DEVICE

SURFACE ANALYZER

REAR PART VEHICLE BODY SUSPENSION STRUCTURE

METHOD OF PRODUCING ALUMINUM ALLOY SHEET FOR FORMING

Pharmaceutical products comprising bisphosphonated

MODIFIED ACYL CARRIER PROTEINS

Paper feeding rubber roller and method of producing the same

Trim angle correction indicating system for outboard motor

Active agent mixture containing a plant extract of convolvulaceae

Semiconductor devices

Process for determining and providing run time information for robot control programs

Information recording medium, information recording apparatus and method, information reproducing apparatus and method, information recording/reproducing apparatus and method, recording or reproduction control computer program, and data structure containing control signal

Closure device and methods for making and using them

Treatment of restenosis

Cellular phone capable of receiving a plurality of broadcast waves

Disk brake devices

Memory device with sector pointer structure