摘要 |
An electronic apparatus includes a housing and an airflow regulating device. The housing defines an accommodating space therein, and an air inlet that places the accommodating space in fluid communication with the external environment. The airflow regulating device includes a cover panel for covering and uncovering the air inlet, and an actuating mechanism coupled to the cover panel and driving movement of the cover panel to adjust the degree of opening of the air inlet in response to a change in temperature in the accommodating space so as to enhance the heat-dissipating efficiency of a cooling fan, minimize crashing and other problems due to poor heat dissipation, avoid the use of a heat-dissipating module that is high in cost and complicated in structure, and reduce manufacturing costs.
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