发明名称 |
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND MANUFACTURING APPARATUS FOR SEMICONDUCTOR DEVICE |
摘要 |
A manufacturing method for a semiconductor device including: determining pattern dependency of a radiation factor of an element forming surface of one wafer having a predetermined pattern formed on the wafer; determining a heating surface of the wafer, based on the pattern dependency of the radiation factor; holding the one wafer having the determined heating surface and another wafer having a determined heating surface, spaced at a predetermined distance in such a manner that non-heating surfaces of the one wafer and the another wafer oppose to each other; and heating the each heating surface of the one wafer and the another wafer.
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申请公布号 |
US2009325324(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20090490753 |
申请日期 |
2009.06.24 |
申请人 |
KAMIMURA MASAKI;YOSHINO KENICHI |
发明人 |
KAMIMURA MASAKI;YOSHINO KENICHI |
分类号 |
H01L21/66;H05B3/68 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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