| 摘要 |
A STICKING APPARATUS INCLUDES A STICKING TABLE (21) FOR SUPPORTING A SEMICONDUCTOR WAFER (W) AND A STICKING UNIT (24) THAT PEELS OFF AN ADHESIVE SHEET (S1) FROM A RELEASE LINER (PS) AND STICKS THE ADHESIVE SHEET TO THE SEMICONDUCTOR WAFER (W). THE STICKING UNIT (24) HAS A DETECTOR (60). THE DETECTOR (60) IS DISPOSED ABOVE A FEED-OUT PATH OF A RAW STRIP SHEET (L) FOR DETECTING A DISPLACEMENT AMOUNT (S) OF THE ADHESIVE SHEET (S1) IN THE LATERAL DIRECTION PERPENDICULAR TO THE FEED-OUT DIRECTION THEREOF. WHEN THE DISPLACEMENT AMOUNT (S) IS DETECTED, A DISPLACEMENT CORRECTION DEVICE (51) IS ACTIVATED AND THE STICKING TABLE (21) IS MOVED BY A DISTANCE CORRESPONDING TO THE DISPLACEMENT AMOUNT (S), THEREBY THE ADHESIVE SHEET (S1) CAN BE STUCK ONTO THE SEMICONDUCTOR WAFER (W) IN ACCORDANCE WITH THE OUTER SHAPE THEREOF. THE ADHESIVE SHEET (S1) IS STUCK ONTO THE WAFER (W) BY A STICKING ROLL (61), WHICH IS BROUGHT INTO A CONTACT WITH THE RELEASE LINER (PS) TO IMPART A PRESSING FORCE THERETO. |
