发明名称 CIRCUIT SUBSTRATE HAVING CIRCUIT WIRE FORMED OF CONDUCTIVE POLARIZATION PARTICLES, METHOD OF MANUFACTURING THE CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE CIRCUIT WIRE
摘要 A circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit.
申请公布号 US2009321953(A1) 申请公布日期 2009.12.31
申请号 US20080207124 申请日期 2008.09.09
申请人 KANG TAE MIN 发明人 KANG TAE MIN
分类号 H01L23/522;H01L23/48;H01R12/50;H05K3/10 主分类号 H01L23/522
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