发明名称 |
CIRCUIT SUBSTRATE HAVING CIRCUIT WIRE FORMED OF CONDUCTIVE POLARIZATION PARTICLES, METHOD OF MANUFACTURING THE CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE CIRCUIT WIRE |
摘要 |
A circuit substrate includes a substrate body having a first terminal and a second terminal separated from the first terminal. A circuit wire includes a wiring unit for electrically connecting the first and second terminals by electrically connecting conductive polarization particles that include a first polarity and a second polarity that is opposite to the first polarity. The circuit wire also includes an insulation unit for insulating the wiring unit.
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申请公布号 |
US2009321953(A1) |
申请公布日期 |
2009.12.31 |
申请号 |
US20080207124 |
申请日期 |
2008.09.09 |
申请人 |
KANG TAE MIN |
发明人 |
KANG TAE MIN |
分类号 |
H01L23/522;H01L23/48;H01R12/50;H05K3/10 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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