发明名称 |
GATE STRUCTURE, METHOD OF FORMING THE SAME AND SEMICONDUCTOR DEVICE HAVING THE SAME |
摘要 |
<p>PURPOSE: A gate structure, a forming method thereof, and a semiconductor device including the same are provided to prevent the increase of the sheet resistance of a metal film by forming a nitrification prevention film between a metal film and a nitrification film mask. CONSTITUTION: A gate insulation film(105) is formed on a substrate(100). A polysilicon film(110) is formed on the gate insulation film. A metal film(120) is formed on the polysilicon film. The metal silicide nitrification film is formed on the metal film. The metal silicide nitrification film includes one of tungsten, tantalum, titanium, cobalt, molybdenum, hafnium, ad nickel. The thickness of the metal silicide nitrification film is 5 to 100 angstrom.</p> |
申请公布号 |
KR20090132801(A) |
申请公布日期 |
2009.12.31 |
申请号 |
KR20080058959 |
申请日期 |
2008.06.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHA, TAE HO;CHEONG, SEONG HWEE;BAEK, JONG MIN;PARK, JAE HWA;CHOI, GIL HEYUN;KIM, BYUNG HEE;LEE, BYUNG HAK;PARK, HEE SOOK |
分类号 |
H01L21/336;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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