摘要 |
Disclosed, amongst other things, is a back-up device that is configured to provide a structural support, in use, between a manifold and a housing member within a melt distribution apparatus of an injection molding system. The back-up device is associated, in use, with a valve-gate apparatus within a nozzle drop. The back-up device includes a cold-side member formed from a first material and a hot-side member formed from a second material. The first material is more thermally conductive than the second material. The cold-side member is configured to be thermally connectable, in use, with the housing member and the hot-side member. The hot-side member is configured to be thermally connectable, in use, with the manifold and the cold-side member. The hot-side member is also configured to prevent the cold-side member from directly contacting the manifold.
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