发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM |
摘要 |
There is provided a method that allows semiconductor chips to be obtained from a semiconductor wafer at high yield, while sufficiently inhibiting generation of chip cracks and burrs. The method for manufacturing a semiconductor chip comprises a step of preparing a laminated body having a semiconductor wafer, an adhesive film for a semiconductor and dicing tape laminated in that order, the semiconductor wafer being partitioned into multiple semiconductor chips and notches being formed from the semiconductor wafer side so that at least a portion of the adhesive film for a semiconductor remains uncut in its thickness direction, and a step of stretching out the dicing tape in a direction so that the multiple semiconductor chips are separated apart, to separate the adhesive film for a semiconductor along the notches. The adhesive film for a semiconductor has a tensile breaking elongation of less than 5% and the tensile breaking elongation of less than 110% of the elongation at maximum load. |
申请公布号 |
EP2139028(A1) |
申请公布日期 |
2009.12.30 |
申请号 |
EP20080739474 |
申请日期 |
2008.03.31 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
NAKAMURA, YUUKI;KITAKATSU, TSUTOMU;KATAYAMA, YOUJI;HATAKEYAMA, KEIICHI |
分类号 |
H01L21/301;C09J7/00;C09J201/00;H01L21/52 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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