| 摘要 |
The package of a semiconductor chip (101) has a surface of optical reflection and color, and is substantially free of indentations; the material (105) of the package may be selected from a group consisting of polymers, molding compound, ceramics, metals, and semiconductors. The surface (105a) includes symbols, which contrast optically with the surface. The symbols include lines of approximately circular vapor-deposited spots (110) of ink particles. The spots have a diameter and a thickness (107) of substantially bell-shaped distribution across the diameter; the spots may also overlap. |
