发明名称 DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS
摘要 <p>Embodiments of various electrical housings, particularly display housings, are provided. In this regard, a representative housing, among others, includes one or more electrical components that are disposed at the housing; a thermal attachment that is designed to transfer heat generated by the one or more electrical components; and a rear enclosure that is designed to engage the thermal attachment. The rear enclosure is further designed to dissipate the heat received from the thermal attachment.</p>
申请公布号 WO2009157942(A1) 申请公布日期 2009.12.30
申请号 WO2008US68519 申请日期 2008.06.27
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;ATKINSON, LEE 发明人 ATKINSON, LEE
分类号 G06F1/16;G06F1/20 主分类号 G06F1/16
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