| 摘要 |
PURPOSE: A probe device is provided to perform a test reliably by securing a necessary contact load between a semiconductor wafer and a plurality of probes. CONSTITUTION: A semiconductor wafer(W) is mounted on a mounting table(11). The mounting table has a body and a chuck top. The chuck top is detachably arranged on the body. A driver(12) moves the mounting table to X, Y, and Z directions. A probe card(13) has a plurality of probes(13A). The probes is contacted with electrode pads of the semiconductor wafer. A support(14) horizontally supports the probe card. A controller(15) controls various devices including the mounting table.
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