A method for automatically characterizing plasma during substrate processing is provided. The method includes collecting a set of process data, which includes at least data about current and voltage. The method also includes identifying a relevancy range for the set of process data, wherein the relevancy range includes a subset of the set of process data. The method further includes determining a set of seed values. The method yet also includes employing the relevancy range and the set of seed values to perform curve-fitting, wherein the curve-fitting enables the plasma to be automatically characterized.
申请公布号
WO2009158556(A2)
申请公布日期
2009.12.30
申请号
WO2009US48747
申请日期
2009.06.26
申请人
LAM RESEARCH CORPORATION;KEIL, DOUGLAS;BOOTH, JEAN-PAUL;THORGRIMSSON, CHRISTOPHER
发明人
KEIL, DOUGLAS;BOOTH, JEAN-PAUL;THORGRIMSSON, CHRISTOPHER