| 发明名称 |
FLEXIBLE CIRCUIT WITH COVER LAYER |
| 摘要 |
<p>The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.</p> |
| 申请公布号 |
EP2136993(A1) |
申请公布日期 |
2009.12.30 |
| 申请号 |
EP20080745646 |
申请日期 |
2008.04.11 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
YANG, RUI |
| 分类号 |
B32B27/06;C08G73/10;C08J5/18 |
主分类号 |
B32B27/06 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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