| 摘要 |
<p>PURPOSE: A multi-row leadless lead frame, a semiconductor package thereof, and a manufacturing method thereof are provided to reduce a cost of a bonding wire by reducing a gap between a lead and a die pad part. CONSTITUTION: A pattern for gap filling is formed to a lead frame by a PR(Photo Resist) coating/exposing/developing method(ST11). The gap filling is performed to the pattern through a coating method, a mask pattern forming method, a screen printing method, or a pad printing method(ST12). A micro pattern is formed to a bottom part of the lead frame through the PR coating/exposing/developing method(ST13).</p> |
