| 摘要 |
<p>Provided is a scribing apparatus (1000), which can form scribing lines on two parts at the same time, on the front surface and the rear surface of a bonded substrate formed by bonding brittle substrates, and thus, can shorten a machining time required for cutting out a predetermined number of panel substrates from the bonded substrates, such as a liquid crystal mother panel. The scribing apparatus is provided with a fixed scribing mechanism, which is fixed on a base (301) and forms first scribe lines at the same time on the front surface and the rear surface of the bonded substrate; and a movable scribing mechanism, which is movably arranged on the base (401) and forms second scribe lines parallel to the first scribe lines at the same time on the front surface and the rear surface of the bonded substrate. The fixed scribing mechanism and the movable scribing mechanism are configured so that the first and the second scribe lines are formed at the same time and the distance between the first and the second scribe lines is adjusted by the distance between the both mechanisms.</p> |
