PURPOSE: A light emitting apparatus is provided to expand a wire bonding region and a mounting region of a light emitting chip by forming a circular opening part and a cutting part to a housing. CONSTITUTION: A lead frame includes a first lead terminal(210) and a second lead terminal(220). The first lead terminal has a chip mounting part. The chip mounting part is formed into a diagonal direction. The second lead terminal is electrically separated from the first lead terminal, and has a wire bonding part. The wire bonding part is formed into a diagonal direction according to an extension direction of the chip mounting part. An opening part of a housing(300) exposes at least one part of the wire bonding part and the chip mounting part. A light emitting chip(400) is mounted to the chip mounting part of the first lead terminal. A lead wire(500) electrically connects the light emitting chip to the lead frame.
