| 摘要 |
The module has a housing (10) made of plastic material, a substrate carrier designed with a circuit arrangement, and an electrical connection element emanating from the circuit arrangement. The housing includes a fastening unit (20) for permanent connection with the substrate carrier. The housing includes an elastic sealing device (30) made of plastic material, where the body is directed towards an inner main surface of the substrate carrier, and is rotated and formed with the housing as a single piece. An independent claim is also included for a method for manufacturing a power semiconductor module. |
