发明名称 |
Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method |
摘要 |
There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stacking which are provided around or in the connection region on the substrate, wherein a reinforcing member as a reinforcing region for reinforcing a portion between the plurality of alignment marks is provided on the substrate.
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申请公布号 |
US7638888(B2) |
申请公布日期 |
2009.12.29 |
申请号 |
US20080031363 |
申请日期 |
2008.02.14 |
申请人 |
PANASONIC CORPORATION |
发明人 |
SUZUKI NAOKI;NAKAHASHI AKIHISA;MAEGAWA YUKIHIRO |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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