Method of fabricating a via attached to a bond pad utilizing a tapered interconnect

摘要

Various embodiments include a method of forming an interconnect comprising forming at least two vias in a substrate, forming a conductive pad on a surface of the substrate, forming at least one tapered conductive segment on the surface of the substrate coupled to the conductive pad, wherein only a first via of the at least two vias is formed substantially beneath the conductive pad and is coupled to the conductive pad, a second via of the at least two vias is coupled to the conductive pad by a first one of the at least one tapered conductive segments, the first one of the tapered conductive segments having a first end having a first width and a second end having a second width, the first end being connected to the second via and the second end being connected to the conductive pad, the first width being less than the second width.