发明名称 Method of forming a semiconductor device and structure therefor
摘要 A method of forming a semiconductor device includes forming isolation trenches that are used to isolate some of the electrical elements such as transistors, diodes, capacitors, or resistors on a semiconductor die from other elements on the semiconductor die.
申请公布号 US7638385(B2) 申请公布日期 2009.12.29
申请号 US20050119106 申请日期 2005.05.02
申请人 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC 发明人 GRIVNA GORDON M.;ZDEBEL PETER J.;DOW DIANN
分类号 H01L21/8238;H01L21/8249 主分类号 H01L21/8238
代理机构 代理人
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