发明名称 Semiconductor chip and method of fabricating the same
摘要 There is provided a semiconductor chip having fuses. The semiconductor chip includes fuses each having a first terminal electrically connected to a first logic circuit, a second terminal electrically connected to a second logic circuit, and a blowable region formed between the first terminal and the second terminal; and fuse residues each having the same patterns with those of the first terminal and the second terminal of the fuses, and configured so that patterns corresponded to the first terminals and the second terminals are electrically disconnected from each other.
申请公布号 US7638369(B2) 申请公布日期 2009.12.29
申请号 US20060346311 申请日期 2006.02.03
申请人 NEC ELECTRONICS CORPORATION 发明人 SAKOH TAKASHI;KUBOTA RYO
分类号 H01L29/86;H01L21/475 主分类号 H01L29/86
代理机构 代理人
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