发明名称 |
Positive photosensitive resin composition, method for forming pattern, and electronic part |
摘要 |
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.
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申请公布号 |
US7638254(B2) |
申请公布日期 |
2009.12.29 |
申请号 |
US20080207958 |
申请日期 |
2008.09.10 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
HATTORI TAKASHI;MURAKAMI YASUHARU;MATSUTANI HIROSHI;OOE MASAYUKI;NAKANO HAJIME |
分类号 |
G03F7/023 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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