| 摘要 |
A semiconductor device which can surely prevent a wire bonded to an island from breaking due to, for instance, thermal shock and temperature cycle upon mounting. The semiconductor device includes a semiconductor chip; an island die bonded with the semiconductor chip on the surface; and a wire for electrically connecting the electrode formed on the surface of the semiconductor chip with the island. The semiconductor device is further characterized in that the island has a die bonding region where the semiconductor chip is die bonded, a wire bonding region where the wire is wire bonded, and a continuous groove reaching a circumference of the island are formed between the die bonding region and the wire bonding region of the island.
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