发明名称 SILICON WAFER AND PRODUCTION METHOD THEREOF
摘要 <p>In a silicon wafer having an oxygen precipitate layer, a depth of DZ layer ranging from a wafer surface to an oxygen precipitate layer is 2 to 10 µm and an oxygen precipitate concentration of the oxygen precipitate layer is not less than 5x10 7 precipitates/cm 3 .</p>
申请公布号 SG157294(A1) 申请公布日期 2009.12.29
申请号 SG20090030834 申请日期 2009.05.06
申请人 SUMCO CORPORATION 发明人 SHIOTA TAKAAKI;NAKAYAMA TAKASHI;KABASAWA TOMOYUKI
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