发明名称 |
Multilayer integrated circuit for RF communication and method for assembly thereof |
摘要 |
A low profile radio frequency (RF) module and package with efficient heat dissipation characteristics, and a method of assembly thereof, are provided. In some embodiments, the RF module package comprises a radio frequency integrated circuit (RFIC) attached to a recessed area of a lead frame. The RFIC has an active integrated circuit pattern and a plurality of conductors formed on input/output pads of the active integrated circuit pattern. An integrated passive device (IPD) is attached to the RFIC via the plurality of conductors. The IPD has a passive integrated circuit pattern, a plurality of electrode pads connected to nodes of the passive integrated circuit pattern, and metal-filled vias for electrically connecting the electrode pads to the plurality of conductors. The RFIC includes a plurality of heat conducting vias for conducting heat to the lead frame.
|
申请公布号 |
US7638364(B2) |
申请公布日期 |
2009.12.29 |
申请号 |
US20060528047 |
申请日期 |
2006.09.27 |
申请人 |
AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD. |
发明人 |
KWON YOUNGWOO;CHUNG KI WOONG |
分类号 |
H01L21/00;H01L23/34;H01L23/02;H01L23/433;H01L23/495;H01L23/66;H01L25/16;H01L29/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|