发明名称 Semiconductor device with buried conductive layer
摘要 A semiconductor device includes a first insulator formed at a part under a semiconductor layer, a second insulator formed under the semiconductor layer in an arranged manner avoiding the first insulator and having a relative dielectric constant different from that of the first insulator, a backgate electrode formed under the first and second insulators, a gate electrode formed on the semiconductor layer, and a source layer and a drain layer formed in the semiconductor layer to be respectively arranged on opposite lateral sides of the gate electrode.
申请公布号 US7638845(B2) 申请公布日期 2009.12.29
申请号 US20060535741 申请日期 2006.09.27
申请人 SEIKO EPSON CORPORATION 发明人 KATO JURI
分类号 H01L29/786 主分类号 H01L29/786
代理机构 代理人
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