| 摘要 |
A method for manufacturing an electronic device includes: preparing an electronic component having an electrode; fixing the electronic component to a supporter, the supporter having a support surface and an inlet disposed in a position that is at a side of the support surface and lower than the support surface, by supporting the electronic component with the support surface so that the electronic component does not come into contact with the inlet and so that a part of a surface of the electronic component adjacent to the support surface is exposed out of the support surface and by attracting a region of the electronic component exposed out of the support surface toward the inlet; and electrically coupling the electrode and a conductive pattern with the electronic component fixed to the supporter. |
