发明名称 |
Temperature-adjusting unit, substrate processing apparatus with the unit, and method of regulating temperature in the apparatus |
摘要 |
A substrate processing apparatus includes: a processing room in which a semiconductor substrate may be treated by a process; a cooling unit positioned to cool the processing room, the cooling unit configured to convey cooling fluid; and a temperature-adjusting unit that alters the temperature of the cooling fluid supplied into the cooling unit. The temperature-adjusting unit has a cycling circuit. The cycling circuit has a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expander configured to expand the condensed refrigerant, the expander including a plurality of expansion valves arranged in parallel, and an evaporator configured to evaporate the expanded refrigerant, the evaporator positioned to cool the cooling fluid.
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申请公布号 |
US7637114(B2) |
申请公布日期 |
2009.12.29 |
申请号 |
US20060438006 |
申请日期 |
2006.05.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI DONG-HYUN;PARK MOON-SOO;KIN JONG-CHUL;KIM YONG-DAE |
分类号 |
F25B49/00;A47F3/04;C23C16/00;F25B41/04;F28D15/00;H05K7/20 |
主分类号 |
F25B49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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