发明名称 Temperature-adjusting unit, substrate processing apparatus with the unit, and method of regulating temperature in the apparatus
摘要 A substrate processing apparatus includes: a processing room in which a semiconductor substrate may be treated by a process; a cooling unit positioned to cool the processing room, the cooling unit configured to convey cooling fluid; and a temperature-adjusting unit that alters the temperature of the cooling fluid supplied into the cooling unit. The temperature-adjusting unit has a cycling circuit. The cycling circuit has a compressor configured to compress a refrigerant, a condenser configured to condense the compressed refrigerant, an expander configured to expand the condensed refrigerant, the expander including a plurality of expansion valves arranged in parallel, and an evaporator configured to evaporate the expanded refrigerant, the evaporator positioned to cool the cooling fluid.
申请公布号 US7637114(B2) 申请公布日期 2009.12.29
申请号 US20060438006 申请日期 2006.05.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI DONG-HYUN;PARK MOON-SOO;KIN JONG-CHUL;KIM YONG-DAE
分类号 F25B49/00;A47F3/04;C23C16/00;F25B41/04;F28D15/00;H05K7/20 主分类号 F25B49/00
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