SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to secure flatness of a rear surface of a chip by forming a rear-surface wiring and a rear-surface wiring pad inside a concave part. CONSTITUTION: A semiconductor substrate(1) has a first surface and a second surface. A first conductive film is formed to the first surface of the semiconductor substrate. An interlayer insulation film is interposed between the first conductive film and the first surface of the semiconductor substrate. A concave part(100) is formed to the second surface of the semiconductor substrate. A hole is formed to a bottom surface of the concave part in order to be delivered to the first conductive film. A second conductive film(4d) is formed to a bottom surface of the concave part. An insulation film is interposed between the second conductive film and the bottom surface of the concave part. The second conductive film is electrically connected to the first conductive film.