WAFER DICING APPARATUS CAPABLE OF INSPECTING SEMICONDUCTOR CHIPS DICED FROM WAFER

摘要

PURPOSE: A wafer dicing apparatus capable of inspecting semiconductor chips diced from a wafer is provided to allow clear recognition of an semiconductor chip by forming a lighting apparatus under a stand member formed with a transparent material. CONSTITUTION: In a device, a support(111) is formed with a transparent material. A wafer is mounted at one-side of the support member. A laser beam projection unit cuts the wafer on the support by projecting the laser beam. A lighting-emitting area(114) is installed at the other side of the support in order to guide the light in the direction passing through the support. A vision unit detects the wafer at the one side of the support. A wafer cutting system inspects a cutting state of the wafer from the light leaking out between cut semiconductor chips.