WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A wafer level package and a manufacturing method thereof are provided to prevent a cracking due to a thermal expansion of mechanical impact to a substrate by forming a second bump on a buffer pattern on a first bump. CONSTITUTION: In a device, a plurality of chip pads(120) are formed on a substrate(110). The chip pad is exposed by the first passivation layer(130). A via(135) is connected to the chip pad through the first passivation layer. The metal wiring layer(140) is formed on the first passivation layer. An under bump metal(143) is connected to the metal wiring layer on the first passivation layer. A buffer pattern(145) separated through a trench(160) is formed at the bump metal. The second passivation layer(150) is formed on the first passivation layer. A first bump(170) is formed on the buffer pattern. A second bump(180) is formed on the first bump and the under bump metal.