PHOTOCURING COMPOSITION FOR PRESSURE SENSITIVE ADHESIVE AND DICING DIE BONDING FILM COMPRISING THE SAME

摘要

PURPOSE: A photocurable pressure-sensitive adhesive composition is provided to ensure excellent adhesive force with a ring frame, wafer or die bonding film, good pickup property under a photocurable condition that energy quantity is not constant. CONSTITUTION: A photocurable pressure-sensitive adhesive composition comprises 100.0 parts by weight of an acrylic pressure-sensitive adhesive binder solid containing a vinyl group; 1-30 parts by weight of an esterified quinonediazide; 0.5-5 parts by weight of a thermosetting material; and 0.1-3 parts by weight of a photopolymerizable initiator. The dicing film comprises a base film(100) and a photocurable pressure-sensitive adhesive layer formed on the upper side of the base film.