| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform satisfactory welding when laser-welding a projecting tip end of a lead projecting from an electronic component to a base material by a laser-welding method, without plating the projecting tip end of the lead after cutting. <P>SOLUTION: The laser-welding method includes: a first step of applying plating 20a to the outer surface of a plate-like frame material 23, which has a lead 20 and a frame 22 integrally connected together; a second step of mounting the lead 20 in a state of the frame material 23 on an electronic component 10; a third step of cutting and separating the lead 20 from the frame 22; and a fourth step of laser-welding the lead 20 to a base material 100. In the outer surface of the frame material 23, a hole 24 is formed which is depressed lower than the outer surface of the frame material 23. The hole 24 is formed such that a side thereof extending in the depth direction becomes a projecting tip end 21 of the lead 20 after cutting. In the first step, the plating 20a is also applied to the side of the hole 24. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
