| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method which can bond two base materials firmly with high dimensional accuracy and efficiently at low temperature while electrically connecting conductive parts provided on respective base materials; and to provide a bonded body obtained by electrically connecting two base materials according to the bonding method. SOLUTION: The present method for bonding comprises: a step to prepare a base material 21 provided with a wiring pattern 212 and a base material 22 provided with a wiring pattern 222; a step for forming a liquid coating 31 containing silicone material and an electrically conductive particle 32 on the base material 21; a step to layer the base materials 21 and 22 via an intervening liquid coating 31 to obtain a temporary bonded body 5; a step to electrophorese the electrically conductive particle 32 to be eccentrically located between the wiring patterns 212 and 222; a step to dry the liquid coating 31 to obtain a bonding film 3; and a step to apply energy to the bonding film 3 to develop adhesion of the bonding film 3, thereby bonding the base materials 21 and 22 to obtain a bonded body 1. COPYRIGHT: (C)2010,JPO&INPIT |
