发明名称 MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamping device which enables lowering of a movable platen, on which a mold is mounted, to a low position and clamping of the mold with a large stroke. SOLUTION: This mold clamping device 1 is employed for clamping the mold by fitting together one half of the mold mounted on a stationary platen 2 and the other half of the mold mounted on a movable platen 3 which can move forward/backward to the stationary platen 2. In addition, the mold clamping device 1 comprises (1) a piston 6 arranged on the face part of the opposite side to the opposed face, to the stationary platen, of the movable platen 3, (2) a cylindrical sleeve 5 with both open sides which accommodates the piston 6 retractably in the stationary platen direction, (3) a mold clamping cylinder 4 which accommodates the sleeve 5 retractably in the stationary platen direction, (4) a first advancing/receding means 81 which is arranged outside of the sleeve 5 and actuates the sleeve 5 retractably, (5) a second advancing and receding means 82 which is arranged outside of the piston 6 and actuates the piston 6 retractably, (6) a limiting means which is arranged outside of the sleeve 5 and limits the advancing action of the sleeve 5 in the stationary platen direction, to the specified range, and (7) a pressurizing means which sends a fluid into the mold clamping cylinder 4 and clamps the mold by biasing a pressing force to the piston 6 in the movable platen direction. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009298050(A) 申请公布日期 2009.12.24
申请号 JP20080155873 申请日期 2008.06.13
申请人 MATSUDA SEISAKUSHO:KK 发明人 SATO SETSUO;MATSUKAWA SOTA
分类号 B29C33/24 主分类号 B29C33/24
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