| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor element having an opening on the side of a front surface in a stable fashion, by reducing sticking residues on the front surface of a wafer of cut waste and the like, which are generated by wafer dicing at the time of cutting. SOLUTION: Wafer dicing is performed for a one-cut line by both directional movements in a two-step cut. At this time, in the going direction a half-cut cut line 100A which cuts deeply into a wafer 101 by down-cut is formed. Furthermore, in the returning direction along the cut line 100A, the remaining work portion and dicing tape are fully cut by up-cut to form a cut line 100B. COPYRIGHT: (C)2010,JPO&INPIT
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