| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition having improved adhesion to an aluminum substrate especially, being excellent in insulation properties and heat resistance, and having a high Tg, as well as to provide electric electronic parts insulated using the epoxy resin composition. Ž<P>SOLUTION: This epoxy resin composition comprises, in order to realize the high adhesion and high Tg to the aluminum substrate, (a) an epoxy resin, (b) an acid anhydride, (c) a curing accelerator composed of imidazole or its derivative, and (d) an aluminum chelating agent. The electric electronic parts insulated using the epoxy resin composition is also disclosed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
