METHOD AND SYSTEM FOR INTER-CHIP COMMUNICATION VIA INTEGRATED CIRCUIT PACKAGE ANTENNAS

摘要

Methods and systems for inter-chip communication via integrated circuit package antennas are disclosed and may include communicating one or more signals between or among a plurality of integrated circuits via one or more antennas integrated in a multi-layer package. The integrated circuits may be bonded to the multi-layer package. The antennas may be configured via switches in the integrated circuits or by MEMS switches integrated in the multi-layer package. The signals may include a microwave signal and a low frequency control signal that may configure the microwave signal. The low frequency control signal may include a digital signal. The antennas may comprise metal and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package.