发明名称 PATTERN DRAWING METHOD AND APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To form a high accuracy pattern even when a substrate is moved. <P>SOLUTION: The pattern drawing apparatus includes: a beam oscillator 1; a mask 3 and a mask angle correcting means 11; a scanning device 7 of a beam passing through the mask 3 and a beam position correcting means 10 controlling the inclination of the scanning device 7 to control the irradiation position of the beam; a condenser lens 8 for the beam that emits to the substrate 5 through the scanning device 7; a stage 4 mounting the substrate 5 and moving; and a beam irradiation position correction control means 9 separately transmitting a control signal to the beam position correcting means 10 for correcting the misalignment between the relative moving direction of the substrate 5 and the irradiation position of the beam, and a control signal to the mask angle correcting means 11 for correcting a shift in the inclination of a pattern on the substrate 5 due to the misalignment. The apparatus controls at least one of the factors, which are the irradiation direction and irradiation position of the beam to the substrate 5, the inclination of the mask 3 and the relative moving distance of the substrate 5. Accordingly, a large area can be drawn at a high speed with pulsed light. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009300975(A) 申请公布日期 2009.12.24
申请号 JP20080158426 申请日期 2008.06.17
申请人 HITACHI ZOSEN CORP 发明人 FUKUDA NAOAKI;SUGIO TAKESHI;OKADA TOSHIYUKI
分类号 G03F9/00;G03F7/20 主分类号 G03F9/00
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