| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device structure which reduces on-state resistance and has superior heat dissipating characteristics. <P>SOLUTION: A semiconductor device includes a semiconductor chip having contact regions on an upper or a bottom surface. Each of first and second lead assemblies is formed from a semi-rigid sheet of conductive material and has a lead assembly contact adhered to one of the separate contact regions, respectively, of the semiconductor chip. Each of the first and second lead assemblies has at least one lead connected to and extending from the lead assembly contact. An encapsulant encloses the semiconductor chip, the lead assembly contact of the first lead assembly, and the lead assembly contact of the second lead assembly. The semiconductor device has low electrical and thermal resistance contributions from the package due to the direct connection of the lead assemblies to the chip. <P>COPYRIGHT: (C)2010,JPO&INPIT |
