发明名称 HEAT RADIATION UNIT, SUBSTRATE UNIT AND ELECTRONIC EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat radiation unit for radiating the heat of a heating electronic component simply structured with the spring energized structure by itself. <P>SOLUTION: The heat radiation unit includes: a radiation member 71 having a metal plate 711 formed with a plurality of attachment holes 711a in the peripheral section, the bottom surface of the metal plate adjoining a heating electronic component and a plurality of radiation fins 712 erected on any position other than the attachment holes; an attachment member 72 having an opening 723 through which the radiation fins 712 are put, and a plurality of bosses 73 protruding from the bottom face side to be inserted into each of the attachment holes 711a, and formed with female screws at the central sections; and a plurality of coil springs 76 into which the bosses 73 are respectively inserted. The coil springs 76 are interposed between the attachment member 72 and the metal plate 711, and the bosses 73 are inserted into the attachment holes 711a to fix the radiation member 71 by screws. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009301143(A) 申请公布日期 2009.12.24
申请号 JP20080152200 申请日期 2008.06.10
申请人 FUJITSU LTD 发明人 TATSUGAMI KAZUKI
分类号 G06F1/20;H01L23/36;H05K7/20 主分类号 G06F1/20
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