发明名称 |
PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, PHOTOCURABLE AND THERMOSETTING LAYER, INK, ADHESIVE AND PRINTED CIRCUIT BOARD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a photocurable and thermosetting resin composition that comprises a modified polyester resin bearing an oxetane ring and a carboxy group based on an acid dianhydride in the main chain and an ethylenically unsaturated double bond contributing to photocurability in the side chain, and a phosphorus-containing (meth)acrylic monomer and/or a phosphorus-containing allyl group-containing monomer contributing to flame retardancy. <P>SOLUTION: The modified polyester resin is obtained by causing a polyester resin, comprised of an oxetane ring-containing diol oligomer bearing at least two oxetane rings and a hydroxy group on both ends, a carbonate group-containing diol oligomer bearing at least two carbonate groups and a hydroxy group on both ends, and a residual carboxy group-containing segment based on an acid dianhydride, to react with a (meth)acrylic monomer bearing a functional group reactive with the residual carboxy group. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2009298992(A) |
申请公布日期 |
2009.12.24 |
申请号 |
JP20080158337 |
申请日期 |
2008.06.17 |
申请人 |
TOYOBO CO LTD |
发明人 |
HOTTA YASUNARI;OGI KOJI;KAWAKUSU TETSUO |
分类号 |
C08F290/14;C08G63/64;C08G63/91;C09D11/00;C09J4/02;C09J167/00;C09J167/07;H05K3/28 |
主分类号 |
C08F290/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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