| 摘要 |
<P>PROBLEM TO BE SOLVED: To automatically and simply detect a mounting error in an electronic component packaging device to facilitate the maintenance when the mounting error is detected. <P>SOLUTION: A component is mounted on one of a plurality of component positioning mark locations serving as a targeted mounting location formed on a substrate, and its image is picked up (step S204). The mounting error of the mounted component is calculated based on the image (S205 and S206). After the mounted component is sucked from the substrate and returned to a component supply device (S207), the component is mounted on another mark location, the mounting error on the location is calculated, and these operations are repeated until the component is mounted on all of the mark locations (S208). In such a configuration, the mounting errors for the respective targeted locations can be calculated by using only one component, thereby simplifying the maintenance when detecting the mounting error. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
