发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of attaining high activity of an impurity and preventing performance of the semiconductor device from being reduced. SOLUTION: A method of manufacturing a semiconductor device includes the steps of: forming a gate insulating film 3 including a high dielectric constant insulating film constituted of a material whose specific dielectric constant is higher than that of a silicon oxide film on a substrate 1; forming a gate electrode 4 including a metal on the gate insulating film 3; forming an extension area 5 by implanting an impurity into the substrate while using the gate electrode 4 as a mask; and performing heat treatment upon the substrate 1, into which the impurity has been implanted, through flash lamp anneal or laser anneal. The step of heat treatment includes a first step of irradiating the substrate 1 with pulse light having a predetermined peak intensity and a second step of irradiating the substrate 1 with pulse light whose peak intensity is lower than that of the pulse light in the first step. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009302373(A) 申请公布日期 2009.12.24
申请号 JP20080156470 申请日期 2008.06.16
申请人 NEC ELECTRONICS CORP 发明人 ONIZAWA TAKESHI
分类号 H01L29/78;H01L21/265;H01L21/28;H01L29/423;H01L29/49 主分类号 H01L29/78
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