METHOD FOR MANUFACTURING RESIN SEAL, METHOD FOR MANUFACTURING BOARD FOR PACKAGING LED CHIP, METAL MOLD OF THE BOARD FOR PACKAGING THE LED CHIP, THE BOARD FOR PACKAGING THE LED CHIP AND LED

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a board for packaging an LED chip which enhances a connection reliability simply.

SOLUTION: This method for manufacturing the board for packaging the LED chip has the steps of: clamping a lead frame 10 by an upper metal mold 50 and a lower metal mold 60 for resin molding, whereby a chamfering part 13 is formed on the board packaging face side at an end part located on an outer periphery serving as a package of an LED for a first inner lead and a second inner lead by a protrusion 59 provided in one of the upper metal mold 50 and the lower metal mold 60; and filling a space formed by the upper metal mold 50 and the lower metal mold 60 with resin 80 in the state where the lead frame 10 is clamped by the upper metal mold 50 and the lower metal mold 60. The lead frame 10 is configured to be cut at the end part of the first inner lead and the second inner lead provided with the chamfering part 13.

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