| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress manufacturing cost, and to suppress time-dependent reduction of junction force between a body part of an electronic component and a printed board. Ž<P>SOLUTION: In an electronic equipment 10, a lead 1a projected from a body part 1b of an electronic component 1 to a printed board 3 substantially in parallel is folded to insert it into a lead insertion hole 3a, and a land 3b around the lead insertion hole 3a and the lead 1a are joined by solder 4. In the electronic equipment, the body part 1b is covered by a cover 2 made of rubber or resin having an elasticity, and a convex-shaped snap-fit part 2b is formed on the other surface of the cover 2. A pressed part 2c, which is pressed when the snap-fit part 2b is inserted into a snap-fit part insertion hole 3c of the printed board 3, is formed on an axis line CL that is on a surface of the cover 2 and that passes the snap-fit part insertion hole 3c and the snap-fit part 2b to join the body part 1b of the electronic component 1 and the printed board 3 via the cover 2. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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