发明名称 VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method, in which the film thickness of a vapor deposition film can be detected with high detection accuracy and a vapor deposition film having a desired film thickness can be stably formed. Ž<P>SOLUTION: A deposition amount of a vapor deposition material M vaporized from a housing container 4 is detected at a detecting position different form a vapor deposition position of the vapor deposition material M, by a detection mechanism, as well as the detection position is changed in accordance with a residual amount of the vapor deposition material M in the housing container, so that the detection position can be moved to follow the changes in the distribution density of the vaporized vapor deposition material M. Thereby, even when the distribution density changes, discrepancy between the deposition amount of the vapor deposition material M depositing on a vapor deposition position and a deposition amount of the vapor deposition material depositing on a detection position can be prevented. By the method, the film thickness of the vapor deposition film can be detected with high detection accuracy, and a vapor deposition film having a desired film thickness can be stably formed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2009299158(A) 申请公布日期 2009.12.24
申请号 JP20080156477 申请日期 2008.06.16
申请人 SEIKO EPSON CORP 发明人 FUKASE AKIO
分类号 C23C14/24 主分类号 C23C14/24
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